Showing results: 151 - 165 of 232 items found.
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Arasan Chip Systems, Inc.
Arasan Chip Systems has a complete portfolio of Fast (10/100) Mbps and Gigabit (10/100/1000) Mbps and now 10Gigabit Ethernet IP. Our high quality IP has completed the rigorous interoperability tests at UNH-IOL laboratories and has been widely licensed. Arasan also provides a portable Ethernet driver.
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VP431 -
Abaco Systems Inc
VP431, the next generation of our highly successful VP430, is a 3U VPX commercial off-the-shelf direct RF processing system that features the 3rd-generation Xilinx Radio Frequency System-On-Chip (RFSoC). The VP431 maximizes I/O channel density, reduces the radio frequency signal chain complexity, and allows for heterogeneous processing capability.
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Commander Accelerator -
HARRIS TUVEY
The Commander High Speed Programmer (HSP) is low overhead system designed to test Flash Memories, PLA's and Micro-controllers. The parallel multi-module architecture provides the flexibility to program and test multiple devices. It's full-featured capabilities support chip erasing and programming, sector erasing and programming, sector protect and unprotect, and data verification functions.
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ATECC508A (Qwiic) -
SparkFun Electronics
The SparkFun ATECC508A Cryptographic Co-Processor Breakout allows you to easily add strong authentication security to your IoT node, edge device, or embedded system. It includes two Qwiic ports for plug and play functionality. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard. The ATECC508A chip is capable of many cryptographic processes, including, but not limited to:
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NXE systems -
ASML
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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AVIOR Series -
MPI Photonics Automation
The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
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Ultraview Corporation
Ultraview's ethernet based acquisition boards bring low noise, large channel count solutions to common open-source platforms. The flexibility of being able to combine a large number of publicly available firmware/software modules with laboratory quality data acquisition chips makes many previously difficult project integrations possible at a fraction of the cost of developing the entire system.
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Arasan Chip Systems, Inc.
Arasan Chip Systems provides a complete suite of USB-compliant IP including low speed, high speed and super speed USB products. Arasan became a member of the USB-IF standards body in 1996 and delivered its first USB 1.0 IP product in that year. The offering expanded to USB 2.0 products in 2000 and USB 3.0 products in 2009. Arasan's customer base includes many major systems and SoC companies in variety of industries.
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Analog Devices Inc.
Analog Devices Automotive Audio Bus (A2B®) technology provides critical support to the vehicle infotainment systems of tomorrow. Our A2B products deliver high fidelity audio while increasing fuel efficiency, thanks to upward of 75% less cabling weight. The A2B portfolio helps enables multiple applications such as voice recognition and active noise cancellation. A2B is a single-master, multiple-slave system where the transceiver chip at the host controller is the master.
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G3 Hybrid -
Hilevel Technology, Inc.
The G3 Hybrid is a state of the art system for fast Production test throughput in DC test applications. The system combines the most versatile offerings of features in a single system, at the lowest cost. For devices requiring DC and Continuity test capability only, G3H is a very flexible cost-effective Production Test solution. This approach provides a DC test system with the capability to add logic resources (AC/SCAN) as well as analog resources for Mixed Signal. The HILEVEL G3H embraces low cost while supporting SCAN, giving you the ability to toggle every node in your chip.
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KLA-Tencor Corp
KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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Digilent Inc.
For over two decades, Digilent has proudly worked with Xilinx to become a global leader in the design and manufacturing of cost-optimized field-programmable gate array (FPGA) and System on a Chip (SoC) development boards. Optimized for accessibility and flexibility, our control system boards are suited to a wide array of applications ranging from embedded vison and sensor fusion to networking and RF to embedded measurement and control systems. Enjoy high performance-to-price ratio, ease-of-use through onboard peripheral support, extensive documentation and example designs, and an open-source philosophy.
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KLA-Tencor Corp
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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AP430 -
Manncorp
With the features, performance, and build-quality of systems twice its price, Manncorp's AP430 Fully-Automatic Inline Stencil Printer brings affordability to leading-edge, solder paste printing technology. Capability for 01005 chips, µBGAs, and 12-mil ultra-fine-pitch components is now at a price point that will fit even the most modest budgets of surface mount manufacturers who require full automation and high throughput.
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TS9000 Family -
Advantest Corp.
The TS9000 series leverages Advantest's industry-leading terahertz analysis technology and expertise amassed over our decades as a global leader in semiconductor test equipment. This system provides a new high-speed, high-precision solution for measurement and analysis tasks including IC chip mold thickness and IC package / printed board wiring quality, which existing methods cannot measure adequately.
